Mr. Leonardi has over 25 years of experience in areas of semiconductor packaging, assembly and test. Sales and marketing management positions with companies such as Fico America, General Electric and the Dyna-Craft Division of National Semiconductor, followed years of development and applications engineering with companies including Advanced Micro Devices and LSI Logic Corporation. Continued direct involvement with key industry organizations will also be part of the business development strategy.

About Premier Semiconductor Services, LLC/LP

Premier Semiconductor Services combines industry expertise with the highest quality standards in providing the most complete offering of backend services available today. In addition to electrical test, test engineering development, wafer probe/sort and burn-in services mentioned above, Premier also provides the following services: programming, solder ball attach and rework, tin/lead conversion to or from Pb free, hot solder dip & retinning, solderability testing & restoration, IC recovery from boards, fine & gross leak test, lead inspection, automated lead conditioning, tape and reel, bake & dry pack, ink & laser mark, demark & blacktop, and more. With multiple domestic facilities, Premier is conveniently situated for a fast and accurate alternative to expensive in-house, back-end processing.

For a complete list of services and locations or for more information, visit our web site at www.premierS2.com or Phone : 480-736-1970 x 23 for additional information.