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Premier Semiconductor's
Lead Inspection and Lead
Repair Services assure
component integrity. Our
services include:
tray-to-tray,
tray-to-tape,
tube-to-tube, and
tube-to-tape. Inspection
capabilities typically
include: Coplanarity,
bent leads, sweep,
pitch, standoff, ball
height, ball diameter
and true position for
SOIC, PLCC, SOJ, TSOP,
TSSOP, SSOP, MSOP, VSOP,
QFP, BGA, CCBGA®
& CSP package types.
We have the ability
to record and report
scan data and
statistical summary
reports. Premier
Semiconductor has
multiple platforms to
perform automated lead
repair / conditioning
for any leaded product
from both tray and tube,
which helps to reduce
your scrap expense.
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