IC Package

 

        Premier Semiconductor's Lead Inspection and Lead Repair Services assure component integrity. Our services include: tray-to-tray, tray-to-tape, tube-to-tube, and tube-to-tape. Inspection capabilities typically include: Coplanarity, bent leads, sweep, pitch, standoff, ball height, ball diameter and true position for SOIC, PLCC, SOJ, TSOP, TSSOP, SSOP, MSOP, VSOP, QFP, BGA, CCBGA® & CSP package types.

We have the ability to record and report scan data and statistical summary reports. Premier Semiconductor has multiple platforms to perform automated lead repair / conditioning for any leaded product from both tray and tube, which helps to reduce your scrap expense.

 

 


Lead Repair
µBGA® is a registered tradmark of Tessera, Inc.