Hot Dip

Solder DipAt Premier Semiconductor, high reliability, repeatable results and quick response are all part of the quality package. All product, including military product, is handled with meticulous care using tight ESD controls, stringent lot traceability, and five-year data retention.
Our procedures and processes meet or exceed J-STD-002, MIL-STD-883 & MIL-PRF-38535 specifications. Premier Semiconductor ensures quality and flawless repetitive accuracy for surface mount, thru-hole, and non-standard packages.

 

 


FluxPremier Semiconductor offers many Pb free & tin-lead alloy compositions and processing capabilities for CLCC, JLCC, CQFP, SOJ, LCC, cans, zips, dips, connectors, axial and radial package types. The Premier Semiconductor team also performs XRF, solderability and steam age tests utilizing state-of-the-art equipment.